Bonding Materials 

As a global supplier for electronics assembly and semiconductor packaging, WELDTONE’s bonding solutions include a broad range of underfills, structural adhesives, active alignment adhesives and die attach formulations for bonding, sealing and assembly. 

Our bonding materials provide structural integrity and improve reliability while eliminating the need for tapes, screws and mounting hardware. Our UV and light cure formulations are great alternatives for temperature sensitive devices, offering low temperature cure solutions including dual cure and shadow cure options. 

No matter what your bonding challenge, we can help you find a reliable and cost-effective solution.

 

 

Underfills

Underfills reinforce delicate electronics by bonding leadless components such as CSPs and BGAs to PCBs or substrates. They improve reliability by protecting PCB assemblies from vibration, mechanical shock, moisture and differences in coefficients of thermal expansion (CTE) between the semiconductor device and the PCB or substrate. 

Our formulations use fine fillers for more advanced packages like flip-chip and package-on-Package (POP) components. 

 

Product Type Industry Product Number Product Description
Underfill Automotive - ADAS UF2101 One component, fine filler epoxy underfill for flip chip capillary underfill applications.
Automotive - ADAS UF2100 One component fine filler epoxy underfill for BGAs, CSPs and LGA type underfill applications
Automotive - Displays UF70327DB One component, low viscosity designed for room temperature flow characteristics suitable for underfilling CSPs, BGAs and LGAs type components
Consumer - Smartphone UF2002 Room temperature flow, reworkable, long pot life epoxy underfill  
Consumer - Smartphone UF7001 Room temperature flow, reworkable, high lap shear strength epoxy underfill.
Consumer - Smartphone UF70118 Room temperature flow, long pot life ,high reliability underfill. 
Consumer - Smartphone UF2100 Heating flow, high reliability, low CTE,
Consumer - Cameras UF70118 Room temperature flow, long pot life ,high reliability underfill. 
Consumer - Cameras UF2101 One component, fine particle for flip chip and fine pitch CSPs capillary underfill applications.
Consumer - Cameras UF2100 Heating flow,high reliability, low CTE.
Consumer - Displays UF70327DB Low viscosity material designed to flow at room temperature, high blackness, low OD value. 
Consumer - Storage UF70118 Room temperature flow, long pot life ,high reliability underfill. 
Consumer - Storage UF2100 One component, fine particle for flip chip and fine pitch CSPs capillary underfill applications.
Consumer - Storage UF2101 One component, fine particle for flip chip and fine pitch CSPs capillary underfill applications.
Consumer - Backlighting UF70327BD Black underfill encapsulant for dispensing underneath and between LED chips for mechanical reinforcement of micro chips
Semiconductor - Materials UF70817 One component, no filler epoxy underfill for the COF/COG  application. 
Semiconductor - Materials UF21308 One component, fine particle epoxy underfill for fcBGA / fcCSP applications. Low CTE and good moisture and heat resistance. 
Semiconductor - Materials UF21860 One component, fine particle epoxy underfill with High Tg performance, suit for the CoWoS application.
Semiconductor - Cameras UF2100 One component, fine particle filled epoxy designed for capillary underfilling CSPs and BGAs components.
Semiconductor - Optical UF2100 One component, fine particle filled epoxy designed for capillary underfilling CSPs and BGAs components.

 

Structural Adhesives

Bonding adhesives for structural assembly is central to the aesthetics, function and reliability of consumer electronic devices. They eliminate the need for tapes, screws and mounting hardware, while creating barriers to moisture and external contaminants that can cause reliability issues.

WELDTONE’s structural adhesives are ideal for consumer electronics, offering fast fixturing, high bond strength in various chemistries, and enable bonding of dissimilar substrates while delivering process-friendly production processes.  

 

Product Type Industry  Product Number  Product Description
Structural Adhesive Consumer - Smartphone 7025B high bonding strength and excellent impact resistance
Consumer - Smartphone 7128B Low modulus and high bonding strength
Consumer - Smartphone TF023 light shielding, design for LCD module edge sealing
Consumer - Smartphone 3289 fast fixture and high bonding strength on aluminum plastic film 
Consumer - Smartphone 7012S low viscosity and low VOC, design for the acoustic application

Consumer-Smartphone

 5354BR suitable open time and high bonding strength
Consumer-Smartphone 2025B general purpose PUR for structure bonding
Consumer - Wearable 7039 -
Consumer - Wearable 7036E High bonding strength and excellent sealing performance
Consumer - Wearable WB136 Excellent bonding strength for various substrates
Consumer - Notebook 35156B Fast fixturing, high bond strength, high impact resistance and good re-work ability
Consumer - Notebook WB137F Fast fixture and excellent bonding strength 

 

Active Alignment Adhesives

WELDTONE’s UV and light curable adhesives are ideal for optical applications like automotive ADAS camera module assembly. Our one-part, solvent free, low shrinkage materials cure in seconds upon exposure to LED or UV light, allowing complex assemblies to be aligned and bonded quickly. 

They are designed to bond dissimilar substrates, including plastics, metal and glass, and withstand moisture and thermal shock for high-reliability.

 

Product Type Industry Product Number Product Description
Active Alignment Automotive -ADAS CB2152 UV curable epoxy adhesive designed for the assembly of camera modules. High thixotropic material with medium viscosity perfect for aligning components like optical lens with fast cure and low shrinkage.
Automotive -ADAS CB2123 UV curable epoxy adhesive designed for the assembly of camera modules. Dual cure adhesive with excellent flexibility and adhesion after final cure. 
Semiconductor - Optical CB21275 UV dual cure with secondary heat cure epoxy for optoelectronics assembly. Formulated with high Tg and extremely low CTE with good adhesion and ultra low shrinkage to ensure high reliability.
Semiconductor - Optical CB1106-1 One component active alignment adhesive with good adhesion after UV cure. Duel cure adhesive for shadow curing.
Semiconductor - Cameras CB11673 One component designed for active alignment applications. Provide high aspect ratio, good flexibility and good adhesion after UV cure.

 

 

 

Die Attach Adhesives

Die attach adhesives are critical in the manufacture of semiconductor devices, not only for structural integrity, but also as a pathway for heat when utilizing thermally conductive formulations with metal fillers. 

WELDTONE die attach materials are designed to create strong bonds, with low warpage and fast curing. They secure integrated circuits (ICs) to a variety of packaging substrates, from camera modules to power transistors.

Product Type Industry  Product Number Product Description
Die Attach Semiconductor - Materials ECA25108 Conductive adhesive, designed for high-speed dispensing with standard thermal and electrical performance.
Semiconductor - Materials ECA15209 Conductive adhesive with excellent thermal conductivity performance(20W/mK).
Semiconductor - Materials ECA25812 Sintering conductive adhesive, Super High thermal and electrical conductivity performance, The thermal conductivity could reach up to  >90W/mK.
Semiconductor - Cameras DA21101 Non-conductive, one component epoxy designed for low shrinkage, low modulus and low warpage applications.
Semiconductor - Cameras DA21101HM Non-conductive, one component epoxy for Die attach, the High Modulus Version for DA21101.
Semiconductor - Optical ECA25118 One component, electrically conductive adhesive designed for high-speed dispensing. Excellent electrical and thermal conductivity.