Thermal Solutions
Thermal Interface Materials
WELDTONE’s thermally conductive adhesives act as a thermal interface and electrical insulator between any heat generating electronic component and a heat sink.
Our gap filling materials are designed to fill air gaps and voids to maximize heat transfer for enhanced thermal performance, reliability and lifespan of electronic systems.
Typical applications include computers, automotive, telecommunications, power semiconductors and industrial electronics.
Thermal Interface Materials | Industry | Product Number | Product Description |
TIM | Various | TA2250 | Epoxy based, two-part formulation, heat curing, dispensing, high structural bonding performance with 1 W/MK thermal conductivity. |
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Various | TPOT3210 | Silicone based, two-part formulation, room temperature curing or heat curing, low viscosity, self leveling, excellent environmental stability with 1 W/MK thermal conductivity. | |
Various | TF3235 | Silicone based, two-part formulation, room temperature curing or heat curing, ultra low assembly stress, excellent environmental stability with 3.5 W/MK thermal conductivity. | |
Various | TF3221 | Silicone based, two-part formulation, room temperature curing or heat curing, ultra low assembly stress, excellent environmental stability with 2.1 W/MK thermal conductivity. | |
Various | TA2200 | Epoxy based, one-part formulation, heat curing, dispensing or printing, high thermal and adhesion performance with 3 W/MK thermal conductivity. | |
Various | TG3260 | Silicone based, one-part formulation, pre-curing type, gel like material, excellent environmental stability, high 6 W/MK thermal conductivity. | |
Various | TG3236 | Silicone based, one-part formulation, pre-curing type, gel like material, excellent environmental stability with 3.6 W/MK thermal conductivity. |