Thermal Solutions 

 

Thermal Interface Materials

WELDTONE’s thermally conductive adhesives act as a thermal interface and electrical insulator between any heat generating electronic component and a heat sink. 

Our gap filling materials are designed to fill air gaps and voids to maximize heat transfer for enhanced thermal performance, reliability and lifespan of electronic systems.

Typical applications include computers, automotive, telecommunications, power semiconductors and industrial electronics.

 

Thermal Interface Materials Industry Product Number Product Description
TIM Various TA2250 Epoxy based, two-part formulation, heat curing, dispensing, high structural bonding performance with 1 W/MK thermal conductivity.
Various TPOT3210 Silicone based, two-part formulation, room temperature curing or heat curing, low viscosity, self leveling, excellent environmental stability with 1 W/MK thermal conductivity.
Various TF3235 Silicone based, two-part formulation, room temperature curing or heat curing, ultra low assembly stress, excellent environmental stability with 3.5 W/MK thermal conductivity.
Various TF3221 Silicone based, two-part formulation, room temperature curing or heat curing, ultra low assembly stress, excellent environmental stability with 2.1 W/MK thermal conductivity.
Various TA2200 Epoxy based, one-part formulation, heat curing, dispensing or printing, high thermal and adhesion performance with 3 W/MK thermal conductivity.
Various TG3260 Silicone based, one-part formulation, pre-curing type, gel like material, excellent environmental stability, high 6 W/MK thermal conductivity.
Various TG3236 Silicone based, one-part formulation, pre-curing type, gel like material, excellent environmental stability with 3.6 W/MK thermal conductivity.