Consumer Electronics
WELTONE’s broad range of customized formulations for consumer electronics are robust and reliable, meeting consumers expectations for smart handheld devices, appliances, wearables, computers, televisions and other home devices. Our formulations include underfills, encapsulants and structural adhesives.
Smartphones & Tablets
WELDTONE underfills ruggedize leadless components, such as CSPs, BGAs and LGA type packages used in handheld devices, improving their mechanical drop reliability. Underfills also significantly enhance thermal performance of consumer electronics.
WELDTONE’s fast UV curing encapsulants and structural adhesives are excellent for securing, aligning and sealing sensitive components while offering protection and resistance to drop, shock, vibration, moisture and cleaning chemicals.
| Market | Application | Product Number | Product Description |
| Smartphone & Tablet | Underfill | UF2002 | Room temperature flow, reworkable, long pot life epoxy underfill. |
| UF7001 | Room temperature flow, reworkable, long pot life epoxy underfill. | ||
| UF70118 | Room temperature flow, long pot life ,high reliability underfill. | ||
| UF2100 | Heating flow, high reliability, low CTE. | ||
|
Encapsulation |
UV4634HV | Fast cure UV adhesive. Suitable for FPC reinforcement. | |
| EN1903LV | One component, acrylate based encapsulant designed for electronic component protection. Excellent workability, high flexibility, and good resistance to moisture. | ||
| EN1932BL | Very low odor, long work life, acrylate based encapsulant. | ||
| EN1100 | UV plus thermal dual curing ,acrylate based encapsulant designed for electronic component protection. Excellent workability, high flexibility, and good resistance to moisture. | ||
| UV8900F | UV plus moisture dual cure adhesive, used for encapsulation and protection of electronic devices. Initial cure with UV irradiation with shadow cure reacting with moisture. | ||
|
Structural |
7025B | High bonding strength and excellent impact resistance. | |
| 7128B | Low modulus and high bonding strength | ||
| TF023 | Light shielding, designed for LCD module edge sealing. | ||
| 3289 | Fast fixture and high bonding strength on aluminum plastic film. | ||
| 7012S | Low viscosity and low VOC, design for the acoustic application. | ||
| 5354BR | Suitable open time and high bonding strength. | ||
| 2025B | General purpose PUR for structure bonding. |
Wearable Electronics
WELDTONE offers a wide range of encapsulants and structural adhesives that improve the environmental and mechanical robustness of wearable devices.
Encapsulants add additional protection against moisture, mechanical stress and contaminants such as dust, dirt and cleaning chemicals. Fast, low-temperature, light, UV and dual cure adhesives are ideal for aligning and positioning assemblies during manufacturing processes.
| Market | Application | Product Number | Product Description |
| Wearable Devices (TWS) | Encapsulation | UV83513 Series | IBOA FREE, UV plus moisture dual cure adhesive, red color, high elongation, low hardness, used for encapsulation and protection of electronic devices. Initial cure with UV irradiation with shadow cure reacting with moisture. |
| UV83712R | IBOA FREE, UV plus moisture dual cure adhesive, medium viscosity, red color, high hardness, high lap shear strength. | ||
| UV83416 | IBOA FREE, UV plus moisture dual cure adhesive, medium viscosity, black color, high hardness. | ||
| UV83111R | IBOA FREE, UV plus moisture dual cure adhesive, high viscosity, red color, high hardness. | ||
| Structural | 7036E | High bonding strength and excellent sealing performance. | |
| WB136 | Excellent bonding strength for various substrates. |
Cameras & UAVs
WELDTONE offers a wide range of underfills that ruggedize leadless components, such as CSPs, BGAs, LGAs and WLCSP type packages used in camera modules and unmanned aerial vehicles (UAVs).
Using underfills in production dramatically improves long-term reliability and performance in harsh environments where devices must endure severe thermal cycling and repetitive mechanical stresses.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
| Cameras UAVs | Underfills | UF70118 | Low viscosity designed to flow with room temperature dispensing, ideal for CSPs, BGAs, and LGA components. |
| UF2100 | One component, fine particle epoxy adhesive for capillary underfill applications. | ||
| UF2101 | One component, fine particle for flip chip and fine pitch CSPs capillary underfill applications. |
TVs, Displays & Notebooks
Consumer and industrial display manufacturers are continually striving for better image quality and resolution while display designs are becoming thinner and more sophisticated with enriched functionality.
WELTONE adhesives for OLED and LCD display technologies are specifically designed to bond dissimilar substrates like glass, metal and plastics, while achieving flexible low stress bonds that cure at low temperature.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
| TVs and Displays | Underfills | UF70327DB | Low viscosity material designed to flow at room temperature. High blackness, low OD value. |
| Notebook | Encapsulation | EN1100 | UV plus thermal dual curing ,acrylate based encapsulant designed for electronic component protection. Excellent workability, high flexibility, and good resistance to moisture. |
| AA2169 | High flexibility, low CTE, reworkable, protect components with edge bonding type application. Rapid cure, low stress ideal for BGA type components. | ||
| UV4634HV | Fast cure UV adhesive suitable for FPC reinforcement. Good for bonding dissimilar substrates with good chemical resistance. | ||
| Structural | 35156B | Fast fixture, high bonding strength, high impact resistance and good re-work ability. | |
| WB137F | Fast fixture and excellent bonding strength. |
Storage & Memory
Storage and memory components are the building blocks of most all electronic systems and are used within nearly every industry from consumer goods to automotive and general industrial electronic equipment.
WELDTONE underfill solutions ruggedize BGA connections used in storage and memory ICs, protecting them from fracture when subjected to mechanical and thermal stresses. Our underfills are compatible with hard drives, SSDs and other types of memory devices where strengthening is required to enhance reliability.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
|
Storage(HD, SSD, Memory) |
Underfill | UF70118 | Room temperature flow, long pot life ,high reliability underfill. |
| UF2100 | Heating flow, high reliability, low CTE. | ||
| UF2101 | One component, fine particle for flip chip and fine pitch CSPs capillary underfill applications. |
Mini-LED BLU & Micro-LED
WELDTONE black underfill improves uniformity, sharpness and contrast for better light performance, while also improving mechanical and insulative properties.
Our black underfill enables backlighting and local dimming of advanced LCD and OLED displays and is ideal for mini-LED BLU and micro-LED applications, constructed with thousands of small diodes that are less than 0.2mm.
| Market | Application | Product Number | Product Description |
|---|---|---|---|
| LED Back Lighting | Underfill | UF70327BD | Black underfill encapsulant for dispensing underneath and between LED chips for mechanical reinforcement of micro chips. |
